IEEE A-SSCC 2019

IEEE Asian Solid-State Circuits Conference

 Plenary Talks
November 5 (Tuesday)

China IC industry Development: past, now and future of memory Industry

Mr. Yiming Zhu

Chairman & CEO, ChangXin Memory Tech., China

  • Date: November 5 (Tuesday)
  • Time: (coming soon)
  • Room: (coming soon)
Biography:

YiMing Zhu joined CXMT in 2018 as CEO, and then assumed Chairman in 2019. Before CXMT, Mr. Zhu was founder, Chairman and CEO of GigaDevice Semiconductor Inc. (SSH:603986). He was credited with a pioneer of China Memory Industry; He started his career in USA as a R&D engineer before he founded GigaDevice. Yiming received his Bachelor and Master Degree from Tsinghua University and Master Degree from State University of New York at Stony Brook.

Abstract:

China is rising as one of the biggest IC consumers in past several years. Due to widely well accepted mobile ecosystem, the exploding Chinese mobile payment economy is currently sized at more than 6 trillion US dollars per year, driving a massive demand for real time and secure financial transactions. To meet the exacting needs of this exploding e-commerce industry, both consumer mobiles and data centers require ever increasing amounts of advanced memory. In this session, CXMT Chairman and CEO, Yiming Zhu will share on how the China memory industry had been addressing challenges in technology, supply chain and current progresses to meet the growing needs of the new digital world.

Memory Centric, The Foundation of Next Smart Society

Mr. KyoWon Jin

Exec. VP & General Manager

DRAM Dev & Biz, SK Hynix, Korea.

  • Date: November 5 (Tuesday)
  • Time: (coming soon)
  • Room: (coming soon)
Biography:

KyoWon JIN became General Manager of DRAM Development & Business in SK hynix Inc. in December 2018 after his 2 years tenure as General Manager, while retaining the position of Executive Vice President of Quality & Reliability Assurance since December 2016.

Prior to his current position, he was Senior Vice President of NAND Development Division from July 2014 and Flash Product Planning from December 2013.

Mr. Jin became a Senior Vice President of Product Planning in August 2009, and he was a Vice President and took the position of DRAM Development Division in charge of DRAM product development from March 2003 to January 2008.

He has been responsible for leading initiatives in the research and development of semiconductor memory for mobile, graphics, server, and future applications. In addition, he had been working for managing quality and reliability of semiconductor memory.

He has worked for semiconductor industry since 1985, acquiring more than 35 years of experience. Mr. Jin has a bachelor's degree in Physics from Seoul National University.

Abstract:

ICT industry is taking a new turn driven by the development of artificial intelligence and network systems. Artificial intelligence has already been used directly and indirectly in everyday life, and the world we live in is becoming more and more smart. However, there are still many tasks to solve. In the future, the artificial intelligence computing system will play a pivotal role in realizing Next Smart Society, so a lot of research is underway in the related industries to improve the performance dramatically.

While various approaches are being developed to utilize artificial intelligence systems, data bottlenecks between artificial intelligence processors and memory are still bottlenecks to improve system performance. In addition, increase in power consumption due to increased bandwidth remains a problem to be solved.

In this keynote speech, I would like to present the direction of memory development for Next Smart Society. Currently, the memory industry is developing a high bandwidth memory to meet the system requirements to contribute to system performance improvement, but it is time to develop more innovative memory technology to meet the requirements of the artificial intelligence system.

In order to do this, we need not only to improve the memory itself but also to combine logic processor with memory to reduce unnecessary bandwidth usage by adjoining memory near processor with diversification of System in Package assembly technology. Furthermore, it is necessary to change the architecture of computing system so that collaboration with people from adjacent fields is essential.

November 6 (Wednesday)

AI and IoT for Social Value Creation

Dr. Yasunori Mochizuki

NEC Fellow, NEC, Japan

  • Date: November 6 (Wednesday)
  • Time: (coming soon)
  • Room: (coming soon)
Biography:

Dr. Yasunori Mochizuki is an NEC Fellow since April, 2019 and is engaged in Digital Transformation and IoT eco-systems strategy for Smart Cities. Previously, he was a Senior Vice President responsible for the NEC’s corporate technology strategy including R&D roadmap and open innovations. He has 30+ years of career as a research scientist and then as a general manager of research departments and his technical expertise covers a broad area including AI-oriented computer science, ICT systems, integrated devices and solid-state physics. Dr. Yasunori Mochizuki is also active in NPO as well as policy making activities related to digital innovation for smart cities: he is a Fellow for Smart City Project of World Economic Forum’s Center for the Forth Industrial Revolution and also is a board member of FIWARE Foundation since March, 2017 representing NEC.

Dr. Mochizuki has published more than 80 papers in technical journals and international conferences. He is the Fellow of Japan Society of Applied Physics. He is a JSAP Executive Committee member of Symposia on VLSI Technology and Circuits, and is also a research advisor to Institute of Industrial Science, University of Tokyo. Dr. Mochizuki received his BS, MS and PhD in Electronics Engineering from University of Tokyo.

Abstract:

What do you want in “Next Smart Society”? How will technologies such as AI and IoT contribute in building it? Not just autonomous cars, drones, robots, e-payments, what are the aspects of digital solutions that will enable more sustainable and inclusive communities? We at NEC, the Social Value Creation Company, are relentlessly pursuing technology R&D and value validation of solutions toward our commitment. In this presentation, I will discuss how the specific features of AI and IoT technologies are connected to the realization of next smart cities/smart communities. The AI topics included are person identification AI for biometrics, white-box/explainable AI for value chain innovation and their use cases will be elaborated in view of how we can create new social values. IoT system for smart cities is another important topic for building a citizen-centric and economically sustainable city. Here, interoperability and openness is becoming increasingly important for scalability and cross-domain data utilization and NEC is taking a leading role in connecting smart city initiatives in Japan under shared IoT architecture based on open API for context information management. City networks and technology associations are now joining forces toward global harmonization, which is the essential clue to next smart society.

CMOS Terahertz Circuits for Radar, Radio, Imager and Spectrometer System Applications

Dr. Mau-Chung Frank Chang

President, National Chiao Tung University, Hsinchu, Taiwan

Wintek Distinguished Chair Professor, Electrical Engineering, UCLA

  • Date: November 6 (Wednesday)
  • Time: (coming soon)
  • Room: (coming soon)
Biography:

Dr. Mau-Chung Frank Chang is the President of National Chiao Tung University, Hsinchu, Taiwan. He is also the Wintek Chair Professor of Electrical Engineering at UCLA. Prior to joining UCLA in 1997, Dr. Chang was the Assistant Director and Department Manager of the High Speed Electronics Laboratory at Rockwell Science Center, Thousand Oaks, California. Throughout his career, his research has primarily focused on developing high-speed semiconductor devices and high frequency integrated circuits for radio, radar and imaging system-on-chip applications up to terahertz frequency regime.

He is a Member of the US National Academy of Engineering, a Fellow of National Academy of Inventors, an Academician of Academia Sinica, Taiwan, and a Fellow of IEEE. He was honored with the IEEE David Sarnoff Award in 2006 for developing and commercializing GaAs HBT and BiFET power amplifiers for high efficiency and high linearity smart-phones throughout the past 2.5 decades. He has also received numerous awards including Rockwell's Leonardo Da Vinci Award (1992), IEEE Davis Sarnoff award (2006), Pan Wen Yuan Foundation Award (2008), John J. Guarrera Engineering Educator of the Year Award (Engineers' Council, 2014), IET’s J.J. Thomson Medal for Achievement in Electronics (2017), and IEEE Eta Kappa Nu (HKN) Vladimir Karapetoff Outstanding Technical Achievement Award (2018).

Abstract:

The infamous “Terahertz Gap” represents frequency spectrum that ranges from 0.3 to 3THz (or 300 to 3000GHz). It lies between traditional microwave and infrared regimes but remains “untouchable” via either electronic or photonic means. The conventional “transit-time-limited” electronic devices can hardly operate even at its lowest frequency; the “band-gap-limited” photonic devices on the other hand can only operate beyond its highest frequency. Since its wavelength ranges from 1000 to 100 μm, Terahertz signals tend to behave quasi-optically and are potentially instrumental for a wide range of scientific and industrial applications. Those include high-data rate, short distance and secured wireless & wireline communications, telemetric and remote sensing based on high-resolution radar, spectrometer and imagers for intelligent traffic/landing control, safety/security screening and bio-medical/food/drug sensing, analysis and controls. In this talk, we will discuss fundamental & technical challenges involved in building Terahertz systems-on-chip from nano-metric CMOS technologies and progresses made recently at UCLA and NCTU to overcome electronic/photonic barriers for realizing highly integrated (sub)-mm-Wave and Terahertz circuits for various system applications.